November 22, 2024, 9:11 am
| 1978-1Product ID is 25959 |
| Stock : | 0 |
| Brand : | TECHSPARY |
| Category List : | |
| Description : | SILICONE FREE HEAT SINK PASTE 1 lb JAR. Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects. Features & Benefits include -Thermal conductivity - 0.92 W/m-K -Functional temperature range -40°F to 392°F (-40°C to 200°C) -Non-ozone depleting -Avoid solder defects due to silicon contamination -Easy application -Will not separate -Will not harden and crack |
| Details : | SILICONE FREE HEAT SINK |
| Selling U/M : | EA |
| Weight: | Ounce:0.000 - Lbs:0 - Kgrams:0 |
| Price : | 71.30 |
| Data Sheet PDF : | |
| Models part used in: | Models Used In |
| Company Home Page : | TECHSPARY |
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