1978-1
Brand: TECHSPRAY
ID: 25959
SILICONE FREE HEAT SINK PASTE 1 lb JAR. Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects. Features & Benefits include
-Thermal conductivity - 0.92 W/m-K
-Functional temperature range -40°F to 392°F (-40°C to 200°C)
-Non-ozone depleting
-Avoid solder defects due to silicon contamination
-Easy application
-Will not separate
-Will not harden and crack
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On Order 0
Due Date: N/A
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$68.22
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$68.22
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In Stock 0 available
Weight
oz: 1.0000
lbs: 0.0625
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