25959


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1978-1
ID:25959
0 USA STOCK
China Stock

ENLARGE 		TECHSPRAY
SILICONE FREE HEAT SINK PASTE 1 lb JAR. Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects. Features & Benefits include -Thermal conductivity - 0.92 W/m-K -Functional temperature range -40°F to 392°F (-40°C to 200°C) -Non-ozone depleting -Avoid solder defects due to silicon contamination -Easy application -Will not separate -Will not harden and crack
Weight oz :0.1
Weight lbs :0.00625

On Order:0.'Due '. 		$71.30

0 USA Stock
0 China Stock

On Order:0 .' Due '.
25959
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